Zibo Seno Electronic Engineering

Zibo Seno Electronic Engineering

Bütün nəticələr 2 göstərilir

Göstər:

D15XB60

Qısaca:
Glass Passivated Die Construction
·
High Case Dielectric Strength of 1500VRMS
·
Low Reverse Leakage Current
·
Surge Overload Rating to 240A Peak
·
Ideal for Printed Circuit Board Applications
·
Plastic Material – UL Flammability
Classification 94V-0
Case: Molded Plastic
·
Terminals: Plated Leads, Solderable per
MIL-STD-202, Method 208
·
Polarity: Molded on Body
·
Mounting: Through Hole for #6 Screw
·
Mounting Torque: 5.0 in-lbs Maximum
·
Weight: 6.6 grams (approx)
·
Marking: Type Number

D25XB60

Qısaca:
Glass Passivated Die Construction
·
High Case Dielectric Strength of 1500V
RMS
·
Low Reverse Leakage Current
·
Surge Overload Rating to 350A Peak
·
Ideal for Printed Circuit Board Applications
·
Plastic Material – UL Flammability
Classification 94V-0
Case: Molded Plastic
·
Terminals: Plated Leads, Solderable per
MIL-STD-202, Method 208
·
Polarity: Molded on Body
·
Mounting: Through Hole for #6 Screw
·
Mounting Torque: 5.0 in-lbs Maximum
·
Weight: 6.6 grams (approx)
·
Marking: Type Number
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